HEICO Corporation has announced that its Electronic Technologies Group has entered into an agreement to acquire rapidly-growing 3D Plus, S.A. (3D). HEICO stated that it expects the acquisition to be accretive to its earnings within the year following closing. Founded in 1996, 3D Plus is a leading designer and manufacturer of 3-dimensional microelectronic and stacked memory products used predominantly in satellites. 3D’s products are also utilized in medical equipment. 3D’s patented designs provide high reliability memory and circuitry in a unique and stacked form which saves space and weight. A majority of 3D’s revenues are derived from sales in growing markets outside of the United States, though it also derives important revenues from the United States.
3D employs approximately 120 people at its new, state-of-the-art design center and factory located in Buc, France. The company also maintains a North American sales and marketing location in McKinney, Texas and technical center in Fremont, Calif. 3D Plus will continue to operate in those locations. Company co-founders, Christian Val, chairman & CEO, and Pierre Maurice, president, will remain with the company after closing. In addition, HEICO stated that it does not expect any staff turnover to result from the purchase. 3D Plus will maintain its headquarters, design and production at its existing headquarters and it will continue to sell its product line to existing customers.